Synthesis of large-area and aligned copper oxide nanowires from copper thin film on silicon substrate

Large-area and aligned copper oxide nanowires have been synthesized by thermal annealing of copper thin films deposited onto silicon substrate. The effects of the film deposition method, annealing temperature, film thickness, annealing gas, and patterning by photolithography are systematically investigated. Long and aligned nanowires can only be formed within a narrow temperature range from 400 to 500 ◦C. Electroplated copper film is favourable for the nanowire growth, compared to that deposited by thermal evaporation. Annealing copper thin film in static air produces large-area, uniform, but not well vertically aligned nanowires along the thin film surface. Annealing copper thin film under a N2/O2 gas flow generates vertically aligned, but not very uniform nanowires on large areas. Patterning copper thin film by photolithography helps to synthesize large-area, uniform, and vertically aligned nanowires along the film surface. The copper thin film is converted into bicrystal CuO nanowires, Cu2O film, and also perhaps some CuO film after the thermal treatment in static air. Only CuO in the form of bicrystal nanowires and thin film is observed after the copper thin film is annealed under a N2/O2 gas flow.